As of 2020/12/01

Model Number		DY-2000RC-xxx	DY-3000RC-xxx
Supported Workpiece Size		ø 4 / 6 / 8 [inch]	ø 300 [mm]
Measurement Items		Surface profile, thickness, Semi standard measurement (SORI/ BOW/WARP/GBIR etc.)
Measurement Object		Warpage and thickness of semiconductor wafers of Si / SiC / GaN / Ga2O3 / LT / LN / GaAS, etc. Warpage and thickness of bonded wafers of the above semiconductor materials Warpage and thickness of carrier glass for wafers and bonding layer for bonding TAIKO wafer warpage, thickness and rim dimension measurement
Supported Environments		Clean room ISO Class 1 (ISO 14644-1)
Sensitivity		Micro-motion: 0.05μm
Minimum Resolution	(XY)	1.000 [mm]
	(Z)	0.01 [um]∗ 1 ∗ 2
Throughput		Approx. 60 sec/sheet (Pitch: θ - 2deg, X - 4mm, 2rps)∗ 3
Main Configuration		Main unit (measuring mechanism / displacement sensor / control device / PC / safety cover) Control console (touch panel / keyboard / mouse) Measurement software Other accessories
Number of Ports		2 or more
ID		QR Code or RF-ID
Cassette Transport		OHT or stocker
Safety		SEMI S2 / S8, IEC 1602040-1, ISO 12100
Utilities	Power Source	1ø 200V 20A
	Positive Pressure	10.6MPa 80L/min min. ø8mm One-touch connector
	Negative Pressure	10.6MPa 80L/min min. ø8mm One-touch connector
	Vacuum Exhaust	One-touch connector (ø8mm)
	Exhaust	ø100mm Flange for duct hose
	Drain	One-touch connector (ø8mm)
Size		W:1555 × D:2103 × H:1640 (1876 including indicator light) [mm]
Weight		Approx. 2,200kg

∗ 1 The minimum measurement resolution is subject to change depending on the mounted sensor.
∗ 2 This equipment is for export.
∗ 3 The maximum measurement resolution may slow down depending on the sampling cycle of the mounted sensor.