As of 2020/12/01

Model		DY-3001XY-xxx
Measurement Items		Surface Profile, Thickness, SEMI Standard Measurements (SORI/ BOW/WARP/GBIR, etc.)
Measurement Targets		Semiconductor materials such as Si / SiC / GaN / Ga2O3 / LT / LN / GaAS wafers and bonded wafers: warping and thickness. Transparent materials such as glass and quartz (SiO2): warping and thickness. Resin materials such as film / resin / adhesives: warping and thickness. Flatness of metal parts and electronic substrates.
Operating Environment		Clean Room ISO Class 6 (ISO 14644-1)
Maximum Measurement Area		□300 [mm]
Minimum Resolution	(XY)	0.001 [mm] (up to 25 million points = 5,000 x 5,000 points)
	(Z)	0.01 [um]※1※2
Measurement Speed (Max※3/ Min)		200 mm/s※3/ 1mm/s
Movement Speed (Max / Min)		200 mm/s / 1mm/s
Main Components		• Main Unit (Measurement Mechanism / Displacement Sensor※4 / Control Device / PC / Safety Cover) • Control Console (Monitor / Keyboard / Mouse) • Measurement Software • Other Accessories
Options	Work Holder※5	• 3-point support holder for 12-inch wafers • Suction holder for 12-inch wafers • Porous suction holder for 12-inch wafers • Breadboard table with M6 matrix taps • Other custom holders/tables※5
	Safety Cover	• Transparent Acrylic Safety Cover
	Console	• Monitor / Keyboard Stand • Rack Table
Power Specifications※6		AC100 V to 120 V※7, -15% to +10%
Power Consumption		1500 W
Dimensions		W:1203 x D:902 x H:1439 (Indicator 1958) [mm], excluding monitor and keyboard
Weight		Approximately 450 kg

※1 Minimum measurement resolution may vary depending on the installed sensor.
※2 This equipment is subject to export control.
※3 The maximum measurement speed may decrease depending on the sampling cycle of the installed sensor.
※4 For details on the main compatible displacement sensors, please contact us.
※5 Custom work holders other than those listed are also available. Please contact us for details.
※6 Only AC power is required for utility.
※7 AC200V specifications are also available; please contact us for details.