Legend for Measurement Items: ◎: Optimum, ◎: Possible, △: Partially Possible, O: Wrong

Category	Material / Article	Status	Size		Measurement Items*1 *2
			XY	T	Surface Profile	SORI	BOW	WARP	Thickness	TTV	GBIR
Semiconductor (Wafer)	Si SIC GaN Sapphire(Al2O3) Ga2O3 GaAs Si3N4 LT(LiTaO3) LN(LiNbO3) Glass Crystal(SiO2) InP AlN Diamond(C) CdTe	Polished Grinded CoinRoll As Slice Etched Patterned Laminated Bonded CVD TAIKO MEM	<Φ12inch <□300[mm]	1<T<800 [um]	◎	◎	◎	◎	◎	◎	◎
Semiconductor (Plastic)	Plastic Film Redin Resist Glue	Laminated Bonded	<Φ12inch <□300[mm]	1<T<2000 [um]	◎	◎	◎	◎	◎	◎	◎
Semiconductor (Other)	Cu-Mo Cu-W AlN	Metal Plate Ceramic Plate	<Φ12inch <□300[mm]	>100 [um]	◎	◎	〇	△*2	△*2	△*2	△*2
Device	Heat Sink Metal Component Cover Glass Ceramic Plate ...etc.	IGBT SIC Power Module FPD Module SOFC Parts Suction Plate ...etc.	<□300[mm]	>50 [um]	◎	◎	〇	△*2 *3	△*2 *3	△*2 *3	△*2 *3
Other	Glass Epoxy Metal Ceramic Plate ...etc.	Substrate Metal Component Brake Friction Pad ...etc.	<□300[mm]	>200 [um]	◎	◎	〇	△*2	△*2	△*2	△*2

*1 Items that can be measured may vary depending on the material and surface conditions. Sample measurement is available, so please contact us.
*2 Custom-made equipment may be designed and manufactured to enable measurement of items that normally cannot be measured, so please contact us.
*3 For transparent materials such as glass through which visible and near-infrared light can penetrate, it may be possible to measure the thickness of the measurement area, so please contact us for details.